Potting Electronics with EpoxyOver the decades, Hapco’s Di-Pak™, Sympoxy™, and Ultraclear™ product lines have earned a reputation in the electronics and underwater industries for its superior quality epoxies and polyurethanes used in potting and encapsulation in component manufacturing. Outside of the finely-tuned properties, the availability and consistency of these formulations give our customers peace of mind, providing reliable and easy-to-use solutions for potting needs and ensuring all kinds of electrical components are safely sealed against even the toughest conditions.

Hapco is proud to offer high-quality potting compounds that fulfill customer-specific project needs. Through its exceptional product line and outstanding customer service, Hapco continues to set the benchmark in the industry. Hapco’s Di-Pak™ product line has been used for potting, encapsulating, and component manufacturing since the early 1980’s.

Potting is a process of filling an electronic assembly with a thermoset resin or heat cured powder for resistance to shock and vibration, and for protection from moisture and corrosive agents. Although often confused for each other, potting is different from encapsulation in that it retains the shell that is used to contain the thermoset resin while it’s curing.


Encapsulation involves building a mold or frame around an object, e.g., wires, filling the space between the frame and the object with a thermosetting resin, waiting for the resin to cure, and then removing the frame.

These processes are commonly employed to protect semiconductor components from moisture and mechanical damage. They are also used in high voltage products to allow live parts to be placed much closer together, so that the product can be smaller. They keep dirt and conductive contaminants such as impure water out of sensitive areas and serve as structural reinforcement, protecting sonar transducers and other deep submergence items from collapsing under extreme pressure. Potting with black or opaque epoxies and polyurethanes can be used to discourage reverse engineering of proprietary products such as printed circuit modules.

Potting and Encapsulating Underwater ComponentsEncapsulation can also be used as a way to display or preserve delicate items such as insects, flowers, stamps, coins, and other collectables. When void-free potting and encapsulating is desired, place the product in a Molding Chamber while the resin is still liquid. Applying 70-80 PSI will collapse the voids and force the liquid resin into all internal spaces.

Benefits of Potting and Encapsulation

Potting and encapsulation offer a wealth of advantages for a diverse range of products. They serve as a protective measure, enclosing components in a neutral compound, which safeguards delicate parts from moisture, dust, chemicals, and potential corrosion.

This additional shield enhances the product’s structural integrity, extends its lifespan, provides mechanical strength, and minimizes any electrical interference that could affect performance. Moreover, potting compounds help to distribute heat more evenly across the components. These features make potting and encapsulation one of the most cost-efficient methods to safeguard a product throughout its operational lifetime.

Different types of pots and capsules

At Hapco, Inc., our Di-Pak™ and Sympoxy™ product lines offer a variety of potting and encapsulation materials to meet your project’s specific needs. Our potting and encapsulating products are designed with a range of properties to suit different applications, such as:Hapflex™ 500 Series

  • Superior fill ability
  • High impact strength
  • Heat resistance
  • Chemical and solvent resistance
  • Excellent adhesion to various substrates

Hapco’s product offering for potting and encapsulation can be broken down into three categories: 

  • Epoxy resins: These thermoset epoxies offer superior strength, superior adhesion, good electrical insulation properties, high chemical resistance, heat dissipation capabilities, low shrinkage values upon cure, and excellent structural bonds.
  • Polyurethane: Polyurethane is a popular choice in the manufacturing industry for potting and encapsulating due to its versatility, strong structural integrity, and essential chemical durability. As polyurethane does not melt or corrode under average temperatures and pressure, it is an excellent casting material for delicate electronics that need protection from humidity or water damage.
  • Epoxy Powders: Heat-cured epoxy powders, such as Sympoxy 1960G by Hapco, present an optimal solution for potting applications that require resistance to exothermic or curing temperatures exceeding 85°C. Unlike other potting materials, powders ensure protection against thermal expansion/contraction, which could otherwise cause damage to delicate components. 

Things you should consider before potting or encapsulating your product

Before you begin the process of potting or encapsulation, it’s crucial to keep a few key factors in mind to guarantee the best outcome.

  • Carefully select the potting compound that aligns best with the needs of your product. Different materials will necessitate specific compounds, so it’s essential to choose wisely.
  • Ensure that your chosen potting compound is compatible with the composition of your component. This step will help to prevent any unintended chemical interactions that could occur.
  • Gently heat any internal metallic components that will interface with polyurethane and epoxy potting compounds. This step is important to prevent thermal shock, which can cause the compound to separate from the substrate.
  • Consider the environment your component will be exposed to. Some compounds offer enhanced resistance to high temperatures or corrosive materials, which can significantly extend the life of your product. Also, consider the mechanical load the component will experience as some compounds provide better mechanical reinforcement than others.

By keeping these tips in mind, you’ll be on your way to a successful potting or encapsulation process.

Choose Hapco, Inc. for your potting & encapsulating needs

At Hapco, we understand the importance of having a reliable and efficient partner for potting and encapsulationprojects. We have the experience and expertiseto help you determine the right solution for your project, whether for potting, encapsulation, or other needs. Contact us to learn more about our Di-Pak™, Sympoxy™, or Ultraclear™ product lines and how we can help you with your project. Contact us today for more information or to get started on your project.