Potting & Encapsulating
Hapco’s Di-Pak™ product line has been used for potting, encapsulating, and component manufacturing since the early 1980’s.
Potting is a process of filling an electronic assembly with a thermoset resin or heat cured powder for resistance to shock and vibration, and for protection from moisture and corrosive agents. Although often confused for each other, potting is different from encapsulation in that it retains the shell that is used to contain the thermoset resin while it’s curing.
Encapsulation involves building a mold or frame around an object, e.g., wires, filling the space between the frame and the object with a thermosetting resin, waiting for the resin to cure, and then removing the frame.
These processes are commonly employed to protect semiconductor components from moisture and mechanical damage. They are also used in high voltage products to allow live parts to be placed much closer together, so that the product can be smaller. They keep dirt and conductive contaminants such as impure water out of sensitive areas and serve as structural reinforcement, protecting sonar transducers and other deep submergence items from collapsing under extreme pressure. Potting with black or opaque epoxies and polyurethanes can be used to discourage reverse engineering of proprietary products such as printed circuit modules.
Encapsulation can also be used as a way to display or preserve delicate items such as insects, flowers, stamps, coins, and other collectables. When void-free potting and encapsulating is desired, place the product in a Molding Chamber while the resin is still liquid. Applying 70-80 PSI will collapse the voids and force the liquid resin into all internal spaces.